Copyright © 2018 LOGICOM

8F., No.56, Sec. 4, Nanjing E. Rd., Songshan Dist.,Taipei City 10553, Taiwan

886-2-2578-0235

www.logi.com.cn .jpg
logo-5.jpg
Bonding

Utilize 12 COB machines to enable the use of less expensive bare chip. Each sample is tested after COB to ensure success before automated sealing epoxy and curing.